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Advanced Semiconductor
Solution
HANA WLS

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Semiconductor Packaging Solution
Bump Fair photo

Bump

We offer solder bumping, Cu bumping solutions
for WLCSP and flip-chip.

  • WLCSP(8inch/12inch)
  • High Performance RDL
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Test Fair photo

Test

We provide test solutions for the electrical test
of wafer level chips (IC) with molded bumps.

  • Wafer Probe Test
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DPS Fair photo

DPS

We provide DSP (Die Processing Service) such as Back grinding, Sawing, Laser Marking, Tape & Reel to the electrically tested product.

  • Advanced Technology
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BUSINESS

We generate a new value for the semiconductor
product through continuous technological innovation.

Semiconductor Package and Test Total Solution Provider

INFORMATION

HANA WLS makes dreams come true in the global arena.

  • Total Solution

    We are a WLP full turnkey solution provider.

  • Advanced Technology

    We are a WLP
    full turnkey solution provider.

  • Value Preposition

    We offer unique and
    differentiated technologies.

  • HANA Micron Group

    We discover and suggest the optimal
    solution that fits customers’ needs.

Company Information HANA WLS’s affiliates playing active parts across the world

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We manage stable growth based on synergy with the group affiliates.
HANA WLS makes dreams come true in the global arena.

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