HANA Micron Logo
We offer solder bumping, Cu bumping solutions
for WLCSP and flip-chip.
- High Performance RDL
We provide test solutions for the electrical test
of wafer level chips (IC) with molded bumps.
- Wafer Probe Test
We provide DSP (Die Processing Service) such as Back grinding, Sawing, Laser Marking, Tape & Reel to the electrically tested product.
- Advanced Technology
We generate a new value for the semiconductor
product through continuous technological innovation.
Semiconductor Package and Test Total Solution Provider
HANA WLS makes dreams come true in the global arena.
We are a WLP full turnkey solution provider.
We are a WLP
full turnkey solution provider.
We offer unique and
HANA Micron Group
We discover and suggest the optimal
solution that fits customers’ needs.