HANA WLS

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We offer solder bumping, Cu bumping solutions
for WLCSP and flip-chip.

We provide test solutions for the electrical test
of wafer level chips (IC) with molded bumps.

We provide DSP (Die Processing Service) such as Back grinding, Sawing, Laser Marking, Tape & Reel to the electrically tested product.

We generate a new value for the semiconductor
product through continuous technological innovation.

Semiconductor Package and Test Total Solution Provider

HANA WLS makes dreams come true in the global arena.

Total Solution
We are a WLP full turnkey solution provider.
Advanced Technology
We are a WLP
full turnkey solution provider.
Value Proposition
We offer unique and
differentiated technologies.
HANA Micron Group
We discover and suggest the optimal
solution that fits customers’ needs.

Company Information HANA WLS’s affiliates playing active parts across the world

We manage stable growth based on synergy with the group affiliates.
HANA WLS makes dreams come true in the global arena.