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Main visual.
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![Semiconductor Packaging Solution](/asset/images/wls_eng/main/row1_text.png)
![Bump Fair photo](/asset/images/wls_eng/main/row1_bg.jpg)
Bump
We offer solder bumping, Cu bumping solutions
for WLCSP and flip-chip.
- WLCSP(8inch/12inch)
- High Performance RDL
![Test Fair photo](/asset/images/wls_eng/main/row1_bg2.jpg)
Test
We provide test solutions for the electrical test
of wafer level chips (IC) with molded bumps.
- Wafer Probe Test
![DPS Fair photo](/asset/images/wls_eng/main/row1_bg3.jpg)
DPS
We provide DSP (Die Processing Service) such as Back grinding, Sawing, Laser Marking, Tape & Reel to the electrically tested product.
- Advanced Technology
BUSINESS
We generate a new value for the semiconductor
product through continuous technological innovation.
Semiconductor Package and Test Total Solution Provider
INFORMATION
HANA WLS makes dreams come true in the global arena.
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Total Solution
We are a WLP full turnkey solution provider.
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Advanced Technology
We are a WLP
full turnkey solution provider. -
Value Proposition
We offer unique and
differentiated technologies. -
HANA Micron Group
We discover and suggest the optimal
solution that fits customers’ needs.